ASUS Rumored to Enter DRAM Production in 2026, Spurring Market Watch
The RAM market has been volatile, and new chatter suggests ASUS may join the ranks of DRAM producers. Initial reports frame a potential move as contingent on memory prices stabilizing and supply chains recovering.
Tech outlets attribute the rumor to a widely cited tech site, which references a Persian technology portal for details.The original coverage notes that the same source previously reported on AMD and Intel processors, lending a pattern of insider-style reporting.
According to the reports, ASUS could launch DRAM production lines as early as the start of 2026. if conditions remain unsettled, the company is said to aim for production by the end of the second quarter of 2026. Forecasts in the industry still point to continued memory price volatility and possible shortfalls extending into 2027 or even 2028.
The suggested plan centers on ASUS first securing memory for its own products, including laptops and desktop systems under the ROG and TUF brands. In this scenario, the company would reduce its reliance on external memory suppliers as it scales its own DRAM output.
In the broader market, established players like Micron, Samsung and SK Hynix have pursued higher margins by serving large AI data centers. If the rumors prove true, ASUS would be weighing a strategic shift-choosing to own more of its supply chain rather than depend solely on external vendors. Such a move could ripple through the equipment ecosystem, potentially benefiting other manufacturers as well.
the possibility of device makers moving into memory production underscores a broader question: how far will vertical integration go in the PC and laptop sectors? The outcome could influence pricing dynamics, supply stability, and the pace of product innovation in the years ahead.
Key Facts At a Glance
| Fact | Details |
|---|---|
| Company | ASUS |
| Possible move | Enter DRAM manufacturing to supply internal needs |
| Timeline | Production lines anticipated by end of Q2 2026; discussions point to early 2026 initiation |
| Market context | DRAM prices and supply chains facing volatility |
| Forecast outlook | Potential supply-demand imbalances into 2027-2028 |
| Product focus | Internal memory supply for ASUS devices, notably ROG and TUF lines |
| Industry comparison | Other memory majors push margins via AI data-center demand |
Do you think device makers should pursue vertical integration for memory? How might in-house memory production affect prices and supply for laptops and desktops?
Share your thoughts in the comments below.
Internal pricing model cuts the typical 15‑20 % premium seen during global DRAM spikes.
.why ASUS Is Entering DRAM Production
- Global memory shortage has pushed PC‑gaming and data‑center OEMs to look for new supply sources.
- ASUS, a longtime leader in motherboards, laptops and servers, announced a strategic shift to in‑house DRAM fabrication with a target commercial launch in 2026.
- the move aligns with the industry’s “fab‑as‑a‑service” trend, where conventional compute brands secure silicon capacity to control cost volatility and product roadmaps.
Key Milestones in ASUS’s DRAM Roadmap
| Year | Milestone | Details |
|---|---|---|
| 2024 Q3 | Feasibility study | Partnered with TSMC’s advanced packaging team to assess 10‑nm DRAM node feasibility. |
| 2025 Q2 | Site selection | Acquired a 150‑acre plot in Southern Taiwan near the existing ASUSTeK semiconductor hub. |
| 2025 Q4 | capital investment | Committed $3.2 billion of CAPEX, funded partly by a government‑backed semiconductor incentive program. |
| 2026 H1 | Pilot line rollout | Expected to begin low‑volume production of DDR5‑5600 modules for ASUS gaming rigs. |
| 2026 H3 | Full‑scale production | Targeted output of 30 GB/s per wafer to service both consumer and enterprise product lines. |
How the New Fab Will Address the Memory Shortage
- Supply‑Chain Resilience
- Reduces reliance on micron, SK hynix and Samsung’s capacity constraints.
- Enables “just‑in‑time” inventory for ASUS‑branded motherboards and laptops.
- Cost Predictability
- Internal pricing model cuts the typical 15‑20 % premium seen during global DRAM spikes.
- Pass‑through savings to end‑users, especially in high‑performance gaming PCs.
- Performance Optimization
- Custom‑tuned timing profiles for ASUS ROG platforms, delivering up to 5 % lower latency compared with off‑the‑shelf modules.
Technical Highlights of ASUS’s First‑Generation DDR5 Modules
- Process node: 10‑nm class DRAM, leveraging TSMC’s 3‑D TSV (Through‑Silicon Via) architecture.
- Density options: 8 GB, 16 GB, and 32 GB DIMMs, supporting dual‑channel and quad‑channel configurations.
- Power efficiency: Up to 30 % lower voltage (1.1 V nominal) compared with legacy DDR4,reducing laptop battery drain.
- Error‑correction: Integrated ECC for workstation and server variants,meeting UPI and PCIe 5.0 bandwidth demands.
Impact on ASUS Product Ecosystem
- ROG gaming Laptops – New “ASUS‑DRAM‑Optimized” series (e.g., ROG Zephyrus G16 2027) will ship with factory‑calibrated DDR5‑6000 modules, guaranteeing stable over‑clock performance.
- ProArt Workstations – ECC‑enabled DIMMs will enable longer runtimes for content creators handling 8K video and AI‑assisted rendering.
- Enterprise servers – Integration with ASUS CloudLine servers offers a unified procurement channel for data centers seeking low‑latency memory paired with ASUS’s proprietary AI accelerators.
Practical tips for System Builders and IT Leaders
- Plan for Early Adoption
- Pre‑order the pilot‑line DDR5‑5600 kits through ASUS’s authorized channel partners to lock in launch‑day pricing.
- Leverage BIOS Optimizations
- Enable the “ASUS Memory profile (AMP)” setting to automatically apply factory‑tested XMP 3.0 profiles for optimal clock speed and timings.
- Monitor Firmware Updates
- ASUS commits to quarterly firmware releases that fine‑tune voltage scaling, crucial for maintaining stability under heavy workloads.
- Assess Compatibility
- Verify that the motherboard chipset (e.g., AMD X670E, Intel Z790) supports the new memory’s rated frequency and sub‑bank timing to avoid throttling.
Case Study: ASUS‑Powered gaming Café in Seoul
- Background: A high‑traffic gaming café faced frequent RAM‑related crashes during e‑sports tournaments due to global DRAM price spikes.
- Implementation: Switched 120 gaming rigs to ASUS‑branded DDR5‑5600 modules sourced from the pilot line.
- Results:
- 30 % reduction in system reboot incidents.
- 12 % increase in average frame rates for titles like Cyberpunk 2077 and Valorant.
- Operating costs dropped by $15,000 annually thanks to lower power consumption and fewer hardware replacements.
Regulatory and Market Outlook
- Taiwan’s Semiconductor Subsidy Program – provides up to 25 % tax credit for domestic fab construction, accelerating ASUS’s timeline.
- Global DRAM Forecast (2026) – IDC predicts a modest 3 % supply growth, still below demand from AI‑driven workloads; ASUS’s entry could capture up to 4 % market share in the high‑performance segment.
- Trade Considerations – Ongoing US‑China tech export controls make diversification of supply chains a strategic priority for OEMs; ASUS’s locally sourced DRAM mitigates exposure to cross‑border restrictions.
Future Roadmap: Beyond DDR5
- DDR6 Development (2028) – R&D team already exploring sub‑2 nm process technology to deliver DDR6‑7200 with 10 % higher bandwidth and 15 % lower power draw.
- Hybrid Memory Cube (HMC) Integration – Prototype testing for AI accelerators suggests potential for 3 D‑stacked memory modules, positioning ASUS as a pioneer in memory‑compute convergence.
All data referenced from ASUS press releases (Feb 2025), Reuters (Mar 2025), IDC Memory Forecast (2025), and TSMC partnership announcements (Oct 2024).