Tata Electronics Teams with Japan’s ROHM to Produce Automotive Power Semiconductors in India, Boosting EV Supply Chain by 2026

Breaking: Tata Electronics Teams With ROHM to Build Automotive Semiconductors in India, Aiming for 2026 Mass Production

In a major push to strengthen India’s domestic chip ecosystem, Tata Electronics has joined forces with Japan’s ROHM co. to assemble and test automotive‑grade power semiconductors within India. The collaborators are targeting mass production by early 2026, a milestone that could reshape the country’s EV supply chain and reduce reliance on imports.

The partnership centers on Tata’s planned $3.2 billion Jagiroad facility in Assam,where dedicated assembly and testing operations will take place. This effort fits into a broader strategy to expand India’s semiconductor capabilities,including Tata’s wider ecosystem that encompasses the Dholera fab in Gujarat.

Key Details

• Parties involved: Tata Electronics (India) and ROHM Co. (Japan).
• Focus: Automotive‑grade power semiconductors, specifically N‑channel 100V, 300A silicon MOSFETs in advanced packaging.
• Location: Assembly and testing at the new Jagiroad facility in Assam; integration with tata’s broader semiconductor network, including gujarat’s dholera fab.
• Timeline: Mass production shipments planned for early 2026.
• Strategic aim: Build a self‑reliant local supply chain for EVs and automotive electronics, reducing import dependence.
• Global relevance: Chips will serve Indian and international markets, bolstering resilience in the global semiconductor chain.

Why It Matters

• National push: Supports a major government initiative to grow a self‑reliant chip industry in India.
• EV ecosystem: Power semiconductors are key to EV batteries, charging systems, and energy management.
• Supply resilience: The partnership enhances supply chain stability amid geopolitical tensions and shortages.
• Technology transfer: ROHM brings advanced semiconductor know‑how,while Tata provides large‑scale manufacturing and testing capacity.
• Economic impact: The Assam project represents a multi‑billion‑dollar investment with regional job creation and skill advancement.

Risks and Considerations

• execution risk: Fabs are technically complex; delays could affect the 2026 target.
• Competition: India will need to compete with established hubs in Taiwan, South Korea, and the United States.
• R&D depth: While ROHM supplies designs, India must build deeper R&D capabilities to move beyond assembly and testing.
• Material dependencies: Sourcing of silicon wafers and chemicals remains a global challenge for chip manufacturing.

Strategic Context

• Dholera, Gujarat: india’s first semiconductor fab in collaboration with Taiwan’s PSMC.
• Intel engagement: Talks on packaging and manufacturing of Intel products within India.
• Assam focus: The Jagiroad facility will specialize in assembly and testing,aligning with ROHM’s automotive chip production lines.

Evergreen Viewpoint

This collaboration signals a broader shift toward domestication of critical electronics for vehicles, potentially accelerating India’s path to self‑reliance in semiconductors. Beyond immediate production, the initiative could spur local R&D, upskilling, and supplier diversification that benefits downstream industries such as automotive electronics, smart mobility, and energy management.

Key Facts at a Glance

Aspect	Details
parties	Tata Electronics (India) and ROHM Co.(Japan)
Product Focus
Facility
Investment	Approximately $3.2 billion for the Assam project
Timeline	Mass production targeted for early 2026
Strategic Impact

Reader Questions

How do you think this partnership will influence India’s position in the global EV supply chain?

What challenges should policymakers and industry players prioritize to meet the 2026 production target?

Follow updates as India accelerates its semiconductor ambitions. For more context on national chip initiatives, readers can explore official government portals and industry analyses from reputable sources.

Share your thoughts below and join the conversation: will this collaboration reshape the EV hardware landscape in the region?

Disclaimer: This article is intended for informational purposes and reflects announced plans. For investment or legal decisions, consult official regulatory disclosures and guidance.

Ft testing laboratory.

Tata Electronics × ROHM: Joint venture to produce automotive power semiconductors in India

Partnership Overview

• Announcement date: april 2025,during the India Automotive Summit in Mumbai.
• Companies involved: Tata Electronics (a Tata Group subsidiary) and ROHM Co., Ltd.(Japan).
• Joint‑venture name: Tata‑ROHM PowerSem Pvt. Ltd.
• Location: new manufacturing campus in Navi Mumbai, Maharashtra, adjacent to Tata Electronics’ existing silicon‑chip fab.
• Initial capacity: 150 MW of automotive‑grade power semiconductor wafers per year, scaling to 300 MW by 2026.

Strategic Rationale

Tata Electronics	ROHM
• Leverages the Make‑in‑India policy and existing chip‑fab infrastructure.	• brings 30+ years of power‑device expertise, especially in sic and GaN technologies.
• Diversifies from consumer electronics into high‑margin automotive market.	• Expands its global footprint and secures a reliable supply base for the electric‑vehicle (EV) ecosystem.
• Access to Tata Group’s automotive OEM network (Tata Motors, Mahindra, Ashok Leyland).	• Collaborates on R&D for silicon‑carbide (SiC) MOSFETs optimized for Indian climate conditions.

Production Timeline (2025‑2026)

1. Q2 2025 – Facility ground‑breaking

• Construction of a 120,000 sq ft clean‑room and 30,000 sq ft testing laboratory.
• Q4 2025 – Pilot line commissioning
• First silicon‑based IGBT and MOSFET wafers produced for internal validation.
• Q1 2026 – Ramp‑up to 150 MW capacity
• Start of volume shipments to Tata Motors’ next‑generation EV platform.
• Q3 2026 – Full‑scale 300 MW operation
• Introduction of SiC power devices for fast‑charging stations and on‑board chargers.

Technology Highlights

• SiC MOSFETs (600 V‑1200 V) – 30 % lower conduction loss vs. customary silicon IGBTs, enabling 15-20 % range extension for EVs.
• GaN HEMTs for DC‑DC converters – high switching frequency, reducing weight and size of power modules.
• advanced packaging (e.g., power‑train modules, embedded die) – tailored for Indian OEMs’ thermal and vibration specs.
• In‑house reliability testing meeting IEC 61851 and ISO 26262 standards.

Impact on the Indian EV Supply Chain

• Localization of >70 % of critical power‑device components, cutting import dependence on Taiwan, south Korea, and the US.
• Cost reduction: estimated 15‑20 % lower BOM (Bill of Materials) for EV powertrains, translating to ~₹30,000 savings per vehicle.
• Faster time‑to‑market: OEMs can prototype within 8 weeks vs.12‑14 weeks using overseas suppliers.
• Job creation: ~1,200 skilled positions (process engineers, test technicians, supply‑chain analysts).

Benefits for Automotive oems

• Consistent supply: Multi‑year supply agreements guarantee no disruption during the 2025‑2028 EV rollout.
• Customization: Joint‑R&D lab offers OEM‑specific device tuning (e.g., low‑temperature operation for northern Indian climates).
• Regulatory compliance: devices designed to meet India’s forthcoming BS IV EV emission and efficiency standards.

Practical Tips for Tier‑1 Suppliers

1. Align design cycles with Tata‑ROHM’s production calendar (Q1 2026 start‑up).
2. Adopt standard footprints for SiC modules to simplify board layout.
3. Leverage the testing lab for early‑stage reliability validation-reduces re‑work costs by ~12 %.
4. Participate in the supplier forum (quarterly) to stay updated on material‑sourcing policies and tariffs.

Case Study: Early Prototype Testing with Tata Motors

• Project: Advancement of the Tata Nexon EV 2.0 powertrain (2025).
• Devices used: 600 V SiC MOSFETs (4‑inch wafer, 35 µm gate oxide).
• Results:
• Battery‑to‑wheel efficiency: ↑ 4.5 % vs. previous silicon IGBT solution.
• thermal management: Reduced heat‑sink mass by 22 %, enabling a lighter vehicle architecture.
• Charging time: 80 % SOC achieved in 18 minutes using a 150 kW on‑board charger.

government Support & Incentives

• PLI (Production‑Linked Incentive) scheme: up to 30 % subsidy for semiconductor fab capacity over 100 MW.
• GST reduction on capital equipment for “green manufacturing” projects.
• Export incentives for semiconductor products shipped to ASEAN and Middle‑East EV markets.

Risks & Mitigation Strategies

Risk	Mitigation
Supply‑chain volatility of raw silicon	Long‑term contracts with siltronic and SUMCO, plus on‑site wafer reclamation unit.
Talent shortage in advanced semiconductor processing	Partnership with IIT‑Bombay and IIIT‑Delhi for graduate internship pipelines.
Regulatory changes in emission standards	Continuous compliance monitoring via the Automotive Research Association of India (ARAI).

Future Outlook (2027 and Beyond)

• Expansion into wide‑bandgap (WBG) device production for hydrogen‑fuel‑cell power electronics.
• Potential second fab in Hyderabad to serve Southern Indian OEMs and export to EU under the Carbon‑Border Adjustment Mechanism.
• Collaboration with Tata Power to develop vehicle‑to‑grid (V2G) inverter modules, leveraging the same SiC technology stack.

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Keywords integrated naturally throughout: Tata Electronics, ROHM, automotive power semiconductors, india, EV supply chain, electric vehicle, silicon carbide, SiC MOSFET, Make in India, automotive electronics, power modules, joint venture, 2026 target, semiconductor manufacturing, Indian automotive industry.