2023-08-29 06:17:33
Amid the turmoil caused by US government sanctions against Huawei’s chip manufacturing division, HiSilicon, speculation is rife about the revival of Kirin systems-on-chips (SoCs).
After the 2019 US sanctions, HiSilicon’s chip production was significantly affected, resulting in a hiatus in the release of new Kirin chips since the launch of the Kirin 9000 at the end of 2020.
However, recent indications from Weibo suggest that Kirin SoCs may be on the verge of making a comeback. Indeed, a Weibo user known as Fixed Focus Digital recently shared which seem to be two potential configurations for an upcoming Kirin chip.
Huawei’s Kirin chips will soon be back
The first configuration would include two Cortex-X3 CPU cores and two Cortex-A715 CPU cores, along with four Cortex-A510 CPU cores and an Arm Immortalis-G715 MC16 GPU. The other configuration would include 2 Cortex-X1, 3 Cortex-A78 and 3 Cortex-A55, associated with an ARM Mali G710 MC10/6 GPU.
There is also speculation about three separate Kirin SoC models: Kirin 720, Kirin 830, and Kirin 9100. The first two are expected to launch later this year, while the Kirin 9100 could be released in 2023. which could coincide with the launch of a highly anticipated device: the Huawei P70.
Meanwhile, Twitter leaker @tech_reve reported that the mysterious Kirin chip could be fabricated using SMIC’s advanced N+2 (7nm) node. Another theory suggests that Huawei could employ a unique approach by stacking two 14nm chips to achieve similar performance to 7nm chips while maintaining power consumption of just 7 Watts.
The possibility of collaborating with the main Chinese founder, SMIC, or of designing innovative solutions for stacking chips, could well be the exit door chosen by the company to circumvent American sanctions. The return of Kirin SoCs could mark a turning point for Huawei’s smartphone lineupallowing the company to regain a foothold in the smartphone market, which the Chinese company had already dominated in the past.
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