Leaked internal slides from AMD show detailed architecture specifications, IPC gains and release dates of the upcoming Zen5 and Zen6 APUs

2023-09-29 21:14:00

Moore’s Law Is Dead leaked information about the next AMD processor Zen5 et Zen6 since late 2022, but its latest video presents a clearer picture with updates to the roadmap, specifications and IPC gains, claiming that this information comes directly from AMD’s internal presentations. However, the roadmap slide might be a bit outdated, as it doesn’t seem particularly clear on release timelines. MLID estimates that Zen5 (Nirvana) built on 4nm/3nm nodes could launch in early 2024, while Zen6 (Morpheus) built on 3nm/2nm nodes could arrive in mid/late 2024. year 2025.

Unlike other leaks that cited fantastic IPC gains of over 30% for Zen5 (Ryzen 8000 ) compared to Zen4, MLID sources seem more realistic and down-to-earth, with IPC increases of ~10-15%+. As for Zen6 (Ryzen 9000), the IPC gains could prove even lower compared to Zen5, with an estimated advantage of at least 10%. This all depends on the actual “achieved” IPC for Zen5, which is not yet shown on the slides and will be known after publication.

Additionally, MLID points out that the Zen5 processor will still feature an I/O die and dual-CCD design introduced with the Zen2, while the Zen6 will feature a new design, perhaps with CCDs stacked on top of the IOD + ultra-fast silicon bridges between the CCDs. So Zen5 processors will feature a 16-core complex at full performance (or up to 32 Zen5c cores at low power), and Zen6 processors will feature a 32-core complex, so we can expect high-end desktop processors with 16 cores at full performance per CCD.

As for the architecture improvements, the Zen5 will get a big increase in architecture AVX-while maintaining a TDP significantly lower than that of Intel. Zen6, meanwhile, will also focus on improving the XDNA AI/ML architecture XDNA AI / ML with FP-16 instructions, and will add a new generation of processors Infinity Fabric and a new memory profiler. Thanks to the new core design, Zen6 is said to achieve “monolithic levels of latency and efficiency”, even though it uses interconnected chiplets. Due to the stacked nature of the package, Zen6 could deliver IPC gains well over 10% in some games, but it might require moving to a new socket.

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