2023-09-07 12:36:00
MediaTek and TSMC announced a new collaboration to develop chips with 3nm lithography. The first announced that its Dimensity line will be graced with technology from the Taiwanese manufacturer, with availability expected in 2024.
The announcement realizes that volume production will only occur next year. However, the arrival of the new hardware commercially still in 2023 is not ruled out.
According to TSMC Senior Vice President of Sales for Europe and Asia, Cliff Hou, the partnership will focus on bringing the most advanced technology of the moment to the most affordable mobile phones on the market.
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means that the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket.”
Cliff Hou
TSMC Senior Vice President of Sales Europe and Asia
When compared to the current 5nm process, 3nm lithography allows for an 18% increase in performance within the same power level. In addition, the technology enables up to 32% energy savings at similar speeds, as well as a 60% increase in logic density.
As the chip is only expected for 2024, the trend is that the future Dimensity 9300 – scheduled to debut in October this year – still does not come with TSMC’s most advanced node. Meanwhile, who should debut the 3 nm on mobile platforms should be Apple, with the A17 Bionic chip, estimated to reduce energy consumption by up to 35%.
So, what do you expect from MediaTek’s future chipset in the 3 nm process? Leave your opinion in the comments below.
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