This new 5G modem wants above all to prepare the ground by betting on compatibility with the next 5G advances to come, while draping itself in a new layer of AI in order to improve reception, especially in environments subject to cuts.
Qualcomm thus announces compatibility with versions 17 and 18 of the 3GPP. Version 18 is currently the most important since it marks the beginning of the ” 5G Advanced “, which should make it possible to focus 5G for good on the development of technologies linked to connected cities and the automotive sector. Clearly, what 5G promised most interesting during its presentation.
Another novelty of the Snapdragon X75: it takes up less space. By rearranging the architecture of its modem, Qualcomm manages to occupy 25% less space, while reducing consumption by 20%, reports The Verge.
The chip also supports better 5G carrier aggregation. The latter make it possible to combine frequencies to send and receive data much faster than when they are used individually. And as it happens, the X75 can support up to 5 sub-6GHz carriers and 10 mmWave (5G millimeter) carriers. A technology that will not be able to be exploited with dignity for a long time, however: it is barely materializing among operators, notes The Verge.