Samsung Foundry’s Debut: Introducing the Tensor G3 Chip with FO-WLP Technology for Enhanced Graphics Performance and Energy Efficiency
2023-09-17 13:30:00 The Tensor G3 chip, which is reported to be manufactured by Samsung and uses the same technology as the Exynos 2400, could be Samsung Foundry’s first chip to use the FO-WLP (Fan-out wafer-level packaging) manufacturing process. This will improve graphics performance and be more energy efficient. FO-WLP has been used by Qualcomm and … Read more