Sony Mobile’s 2023 new flagship, Xperia 1 V.
In Japan, it is likely that it will be passed on as a summer model from the carrier around June, but highly reliable rendered images have already been leaked, and it is said that almost the whole picture has been clarified regarding the appearance. I don’t think it’s an exaggeration either.
Meanwhile, interesting new leak information regarding the “thickness” and cooling function of the Xperia 1 V has come out.
It was posted on Weibo some time ago, according to:
The Xperia 1 V is going to be the thickest yet, because it’s not just big, it’s got a very thick vapor chamber.
According to already leaked CAD data informationXperia 1 V is 8.54mm thick。
This information is believed to be accurate andThere is no doubt that this model will be the “thickest” in the history of the Xperia 1 series。
On the other hand, the thickness of the past Xperia 1 series is:
Xperia 1: 8.2mm
Xperia 1 II: 7.9mm
Xperia 1 III: 8.2mm
Xpria 1 IV: 8.2mm
The Xperia 1 V is the “thickest” because the vapor chamber for heat dissipation is not only large, but also the thickest.and that.
In the previous model Xperia 1 IV, the heat problem became a big problem from the beginning of its release.
Therefore, there have been rumors that the Xperia 1 V will be equipped with a huge vapor chamber, but I have never heard of the “thickest”.
By the way, there is no reliable information regarding the battery capacity of the Xperia 1 V so far, but if it is the same as the previous model (5000mAh), the reason for the increase in thickness is still some change in the heat dissipation mechanism. seems appropriate.
