Samtec’s Success at Embedded World: Scaling Performance with COM-HPC Technology

Samtec Highlights COM-HPC Connector Solutions at Embedded World 2025

NUREMBERG, Germany—Samtec is set to showcase its cutting-edge COM-HPC (Computer-on-Module High-Performance Computing) connector solutions at Embedded World 2025, taking place here. At Booth 4A-324, attendees can explore these connectors designed to meet evolving industry standards for high-speed embedded systems.

COM-HPC Connectors: Powering Next-Gen Embedded Systems

COM-HPC connectors are built on Samtec’s AcceleRate HP High-Performance Arrays. these connectors are integral to both Server and Client modules. The standard modules integrate two 400-pin connectors,providing a total of 800 pins. A Mini module,however,omits one of these connectors for space-constrained applications. This design allows for important data throughput and processing power in a compact form factor.

Samtec states that its “COM-HPC connectors enable PCIe 5.0 (32 Gbps),  PCIe 6.0 (64 Gbps PAM4),25 GbE,40 Gbps USB4/Thunderbolt,and 80 Gbps DisplayPort.” These high-speed capabilities are crucial for modern embedded applications demanding rapid data transfer and low latency.

Key Features and Benefits

• High-Speed Performance: Support for PCIe 5.0 and PCIe 6.0 ensures compatibility with the latest high-speed peripherals and technologies.
• Scalability: designed for Mini, Client, and Server modules, offering flexibility for various submission needs.
• Standardized Form Factor: “In every application, the female Module Receptacles remain at a standard height, with male Carrier Plugs available in configurations supporting either a 5 mm or 10 mm stack height,” according to Samtec, ensuring consistent integration and interchangeability.

COM-HPC vs. COM Express: Understanding the Difference

While both COM-HPC and COM Express serve as standards for Computer-on-Modules (CoMs), COM-HPC offers significant advancements in scalability and performance. According to samtec, “Offering superior scalability and performance, PICMG COM-HPC exceeds the high-speed demands of embedded CoMs/SoMs while complementing the COM Express specification for advanced embedded system development.” COM-HPC caters to more demanding applications requiring higher bandwidth and processing capabilities compared to COM Express.

COM-HPC Module Types: Server,Client,and Mini

COM-HPC modules are categorized into two primary types: server modules for edge computing and client modules for embedded applications. The architecture allows for diverse implementations, tailored to specific computational needs.

• Server Modules: Designed for high-performance edge computing applications requiring considerable processing power and memory capacity.
• Client Modules: Suited for general-purpose embedded applications, balancing performance and power efficiency.
• COM-HPC Mini: Introduced in the 1.2 update, this compact form factor caters to applications with space constraints without sacrificing essential features. The upcoming version 1.3 will define PCIe 6.0 performance details.

future-Proofing Embedded Systems

COM-HPC supports up to 1 TB of system memory and provides flexibility by accommodating diverse compute engines beyond x86, including RISC-V CPUs, GPGPUs, FPGAs, and DSPs. This versatility ensures that embedded systems can adapt to evolving technological landscapes and application requirements.

Attend Embedded World 2025

Embedded World 2025 offers a unique possibility to explore the latest advancements in embedded technologies and network with industry experts. don’t miss the chance to see Samtec’s COM-HPC connectors firsthand. Secure your free ticket here: https://www.messe-ticket.de/Nuernberg/embeddedworld2025/Register/SYS4ew25?culture=en

For additional data, visit samtec.com.

Conclusion

Samtec’s COM-HPC connectors represent a significant leap forward in embedded computing, offering unparalleled speed, scalability, and flexibility. By supporting the latest industry standards and accommodating diverse compute engines, these connectors are poised to drive innovation in edge computing, industrial automation, and beyond. Explore these advancements firsthand at Embedded World 2025 and discover how COM-HPC can transform your next embedded project.Register today to learn more!

What are the key differences between COM-HPC and COM Express?

Driving innovation in Embedded Computing: A Conversation with Samtec’sSenior Product Manager,lan MacDonald

In the heart of Nuremberg, archyde secured an exclusive interview with Ian MacDonald, Senior Product Manager at Samtec, to discuss thier latest advancements in COM-HPC connector solutions at Embedded World 2025.

Introduction to COM-HPC Connectors

Q: ian, could you kickstart our conversation by explaining COM-HPC connectors to our readers unfamiliar with the term?

Ian: Absolutely. COM-HPC, or Computer-on-Module for High-Performance Computing, is a rugged, high-speed connector system that meets evolving industry standards for embedded systems. It’s built on Samtec’s AcceleRate HP High-Performance Arrays, and it’s integral to both server and client modules.

Powering Next-Gen Embedded Systems

Q: Tell us about the capabilities of these connectors. How do they power next-gen embedded systems?

Ian: Our COM-HPC connectors enable PCIe 5.0,PCIe 6.0, 25 GbE, 40 Gbps USB4/Thunderbolt, and 80 Gbps DisplayPort. These high-speed functionalities are vital for modern embedded applications that demand rapid data transfer and low latency.

Key Features and Benefits

• High-Speed Performance: Our connectors support PCIe 5.0 and PCIe 6.0, ensuring compatibility with the latest high-speed peripherals and technologies.
• Scalability: We designed our connectors for Mini,Client,and Server modules,offering versatility for various submission needs.
• Standardized form Factor: The female Module Receptacles maintain a standard height, with male Carrier Plugs available in configurations supporting either a 5 mm or 10 mm stack height, ensuring consistent integration and interchangeability.

COM-HPC vs. COM Express: The Difference

Q: How does COM-HPC differentiate from COM Express?

Ian: While both serve as standards for Computer-on-Modules, COM-HPC offers superior scalability and performance. It caters to more demanding applications requiring higher bandwidth and processing capabilities compared to COM Express.

Module Types: Server, Client, and Mini

• Server Modules: Designed for high-performance edge computing applications, these modules require considerable processing power and memory capacity.
• Client Modules: Suitable for general-purpose embedded applications,these modules balance performance and power efficiency.
• COM-HPC mini: Introduced in the 1.2 update, this compact form factor caters to applications with space constraints without sacrificing essential features. The upcoming version 1.3 will define pcie 6.0 performance details.

Future-Proofing Embedded Systems

Q: how do COM-HPC connectors future-proof embedded systems?

Ian: COM-HPC supports up to 1 TB of system memory and accommodates diverse compute engines beyond x86, including RISC-V CPUs, GPGPUs, FPGAs, and DSPs. This versatility ensures embedded systems can adapt to evolving technological landscapes and request requirements.

Attend Embedded World 2025

Catch Samtec’s COM-HPC connectors at Embedded World 2025. Secure your free ticket here and explore these innovations firsthand.

Thoughts from ian: The Future of Embedded Computing

Q: What excites you about the future of embedded computing?

Ian: I’m thrilled about the potential of edge computing and how innovations like COM-HPC can drive it forward. I believe we’ll see more advancements in processing power, memory, and connectivity, enabling embedded systems to become even more integrated into our daily lives.

Thank you, Ian, for your insights into Samtec’s COM-HPC connector solutions. We look forward to seeing the impact they’ll have on the embedded computing landscape.