2023-12-24 22:43:00
SANTA CLARA – In the evolving semiconductor industry, Intel CEO Pat Gelsinger said the company’s next processing node could outperform rival Taiwan Semiconductor’s future chips. Manufacturing Company (TSMC). As the two tech giants work to refine smaller semiconductor nodes, they are at the forefront of innovation and plan to mass produce advanced chips in the coming years.
Intel is preparing to introduce new technologies, including its RibbonFET architecture, as part of its strategy to advance semiconductor manufacturing. The company is targeting the end of 2024 for the launch of this new semiconductor technology. RibbonFET is Intel’s first new transistor architecture since the introduction of FinFET in 2011, and it promises significant improvements in transistor performance and efficiency.
On the other side of the competition, TSMC has established its roadmap, intending to mass produce its N3P node by the end of 2024. Additionally, TSMC plans the development of its N2 node for 2025. These advances represent crucial steps for TSMC as it continues to push the boundaries of chip performance and power efficiency.
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