2023-09-18 18:54:43
Intel a present its next generation Glass Substrate packaging technology which will replace existing organic materials and offer superior interconnections.
Intel’s next-generation chip packaging will feature a glass substrate, delivering significant interconnect improvements
The technology presented by Intel is “glass substrates”, which replace the conventional organic packaging currently used on existing chips. Before going into the details of how it works, Intel claims that “glass substrates” are the future, and that this packaging technology could quickly enable large-scale innovations in industries, particularly in the areas of HPC and AI, as chip packaging has been in the news a lot lately.
After a decade of research, Intel has succeeded in obtaining cutting-edge glass substrates for advanced packaging. We look forward to delivering these cutting-edge technologies that will benefit our key foundry players and customers for decades to come.
– Babak Sabi, Senior Vice President, Intel
An Intel engineer holds a test glass substrate panel at Intel’s assembly and test technology development facilities in Chandler, Arizona, July 2023. Intel’s advanced packaging technologies take life in the company’s assembly and testing technology development factories. (Credit: Intel Corporation)
The essential element that makes a particular chip packaging technology superior is its ability to fit so many “chips” into a single package. With glass substrates, Intel says manufacturers can now use “larger chip complexes,” which help reduce the footprint of a single package, resulting in a much more efficient and high performance boost.
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Glass substrates now benefit from greater thermal tolerance and a flatter design, which helps with interlayer connectivity. Intel claims that glass substrates offer a phenomenal 10x increase in interconnect density, enabling seamless power delivery.
In the images above, you can see that the border segments of the demo chip above have a glass-like finish. Usually this area of any modern chip is made of organic materials and this is how today’s chips are made. But with glass substrates, Intel can not only make the chips much thinner, but also integrate up to 10 times more interconnect density, which will enable advanced chip designs that will be completely new.
Team Blue has not yet specified a release date for “glass substrates”, but this brings them closer to their goal of “1 billion transistors” in a single package by 2030. Glass substrates will have the most of impact in the HPC/AI industry. However, the next goal is actual adoption of the standard, which we believe will happen in the coming years.
Watch the video of one of our hardware colleagues of the week:
Sources : VideoCardz, WCCF Tech
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