2023-09-17 13:30:00
The Tensor G3 chip, which is reported to be manufactured by Samsung and uses the same technology as the Exynos 2400, could be Samsung Foundry’s first chip to use the FO-WLP (Fan-out wafer-level packaging) manufacturing process. This will improve graphics performance and be more energy efficient. FO-WLP has been used by Qualcomm and MediaTek before, but according to reports, this is the first time Samsung Foundry has used this technology. Tensor G3 chips The 4nm size will be in the Pixel 8 and Pixel 8 Pro. It has a 9 core CPU consisting of Cortex-X3 prime core, Cortex-A715, Cortex-A715s and Cortex-A510. For graphics, it will use the Arm Immortalis G715 10 core GPU, increasing from the previous model. Before using the G710 7 core, the Pixel 8 Series will be launched on October 4th. Source: Gsmarena, Revegnus. Related articles. Follow the news at Siamphone.com at
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