TSMC Kumamoto Factory Opens TrendForce: Japan is expected to form the world’s third largest semiconductor production base

2024-02-23 22:43:45

TSMC’s Kumamoto plant will open tomorrow (24th). TrendForce issued a report today stating that as TSMC continues to expand the scale of its Kumamoto plant, it will affect the development of Japan’s semiconductor industry in the next ten years, and Japan is expected to form the world’s third largest semiconductor production base.

TrendForce stated that global foundry revenue will be approximately US$117.47 billion in 2023, with TSMC accounting for approximately 60%. It is estimated to be approximately US$131.65 billion in 2024, and the global share will rise to 62%. In addition to having the highest revenue share, TSMC has currently selected the United States, Japan, and Germany as the bases for advanced and mature factories. Japan has the fastest progress, and the completion schedule is even ahead of schedule.

TrendForce emphasized that tomorrow will usher in the opening of TSMC’s Kumamoto Factory (JASM), which is also TSMC’s first factory in Japan (Fab23). The monthly production capacity of the first factory will reach 40,000 to 50,000 pieces in the future, and the process will be 22 Mainly /28 nanometer, and a small amount of 12/16 nanometer, in preparation for the subsequent main production process of Kumamoto Factory II.

TrendForce further pointed out that Japan has advantages in the supply of key upstream semiconductor materials, gases and equipment, such as TEL, JSR, SCREEN, SUMCO and Shin-Etsu, which all have oligopoly or leading positions. Japan will likely form three major semiconductor bases, located in Kyushu, Tohoku and Hokkaido. Among them, Kyushu is the most active, which is where TSMC’s Kumamoto factory is currently located. In Hokkaido, Rapidus expects to directly attack the 2-nanometer process and hopes to promote the development of surrounding economies. With the active investment of industry, government and academia, Japan is expected to establish a complete ecological chain of semiconductor manufacturing.

Judging from the current distribution of semiconductor companies in Japan, they are mainly concentrated in the two major regions of Kyushu and Tohoku. The Tohoku region has more Japanese semiconductor talents, and Tohoku University focuses on the development of the semiconductor field. Representative companies here include ROHM, Renesas, and Power Semiconductor Manufacturing Co., Ltd. (PSMC), which recently announced that it will build a 12-inch wafer fab in Sendai. The Kyushu region has the most critical water resources for the semiconductor industry. Its groundwater content is the highest in Japan. The purity of the water is of great help to the development of the semiconductor industry. Currently, major raw wafer manufacturers such as SUMCO and TOK (Tokyo Onka Major bases such as Industrial) are concentrated in the Kyushu area. SONY, ROHM and Mitsubishi Electric (Mitsubishi Electric) all have factories. Therefore, TSMC finally selected Kyushu as the base to build the factory. Water resources considerations were also one of the main reasons.

It is understood that various local governments in Japan are also striving for the third plant that has not yet been finalized. It is currently rumored that in addition to Kumamoto Prefecture, Fukuoka Prefecture in Kyushu and even the Kansai Osaka area are also possible locations. However, because it is In the early planning stages, there are still variables.

In terms of manufacturing process, the third fab is currently planned to be based on 6/7nm process. However, if the completion time of the fab is announced, TSMC’s most advanced process in Taiwan has been promoted to 2nm or even 1.4nm, and it does not rule out the use of 5nm. Or 3nm will be used as the main force of the third factory. In addition, TSMC has also established a 3DIC R&D center in Ibaraki Prefecture, and will plan to establish an advanced packaging plant in Japan and establish a complete layout in Japan from front-end manufacturing plants to back-end packaging and testing plants.

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